MTP-DB3-2
Engineered for low vibration and low noise, this robot supports the next generation of semiconductor fabrication equipment.
Features
- Compliant with 10^-6Pa vacuum environments by adapting servo motor on all axes and unique structure.
- Contact us for materials of end effector and wafer contact portion.
- Configurable with no vertical axis(Z) specifications(Contact us for details)
- Branching arm structure minimizes the turning radius of double hands with maximum reach.
Specifications
| Handling object |
φ100mm to φ300mm SEMI/JEIDA standard wafer. (Please inquire with regard to special wafers such as glass wafers.) 6inch MASK |
|---|---|
| Range of motion | R?590?(maximum arm reach,excluding end-effector) T?370°(±185° from Home pos) Z?104? |
| Repeatability | XY?±0.1mm or less?3σ) Z?±0.05? |
| Handling system | Recess(Pocket) |
| Handling hold check | N/A |
| Vacuum isolation level | 10^-6Pa |
| Communication | RS-232C,RS-485(Serial Interface) |
| Utility | 1φ AC200V?230V 5A 1line |
| Mass |
Main body:Appox.76kg Controller(MCQ)?Appox.16kg |
Contact us for questions about products.
