Bonder
Features
Specifications
| Bonder | TWH-BD series |
| Process work size |
φ200 or 300 mm |
| Alignment accuracy | X-Y: 30μm |
| Bonding Pressure |
φ300: 20kN φ200:10kN |
| Stage specification | Elecro static chuck |
| Heat Temp. | Max 250℃ |
| Vacuum pressure | < 10Pa |
| Bonding accuracy | ttv < 3μm |
| Other | TAZMO Safety specification |
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